Engineering publications brought to you by Mark Allen

Neil Tyler

Sensors

ST enhances sensing creativity with MEMS Studio desktop software solution

Interconnection

Hirose develops right-angle crimp socket for DF60 series

Power

Nisshinbo launches boost/flyback switching regulator controller

Memory

Microchip expands Serial SRAM portfolio with larger densities and increased speeds

Internet of Things

SECO and NXP collaborate to bring Clea to industrial and IoT applications

Test & Measurement

Taking test to the next level

Consumer

Jump in smartphone sales predicted

Policy & Business

Amazon pours additional $2.75bn into Anthropic

Memory

Winbond extends secure flash family with new memory densities andPQC support

Automotive

NXP introduces the Open S32 CoreRide platform

Memory

Silicon Motion unveils latest generation FerriSSD BGA SSD

ASIC & SoC

SEMIFIVE commences mass production of 14nm AI inference SoC platform