Engineering publications brought to you by Mark Allen

Neil Tyler

Robotics & UAVs

XPLOR partners with BOW to drive robotics innovation in film, TV and live events

Power

Ultra-compact, medically approved, 4:1 input DC-DC converters

Electronics

Electroninks unveils copper MOD ink for advanced semiconductor packaging

EDA & Design Software

Altium 365 Apps now available in AWS Marketplace

Electronics

Global Top 10 foundry revenues grow 9.6%

Embedded Systems

AAEON’s PICO & GENE ranges adopt Intel Atom x7000RE processor series

Automotive

Toshiba sampling automotive CXPI responder interface IC with built-in hardware logic

Automotive

SiFive and Arkmicro accelerate RISC-V adoption in automotive electronics

Communications

Liverpool City Region HDD project trials new digital technologies

ASIC & SoC

EnSilica announces first production order for industrial ASIC

Embedded Systems

SEGGER adds scope-like data visualization to SystemView

Memory

Price challenges for memory loom in second half of 2024