Engineering publications brought to you by Mark Allen

Communications Hardware

Bonded wafers could enable large scale photonic integration

Laminated foil touchscreens could provide a way to upgrade your application

Addressing the need for ultra-small ambient light sensors in wearable products

LoRa evaluation kits for Europe and North America

Industry partnership set to develop cache coherent interconnect for data centres

ST partners with Arduino to give easier access to its technology

High power-factor buck LED driver meets worldwide retrofit lamp requirements

Partnership to develop next generation automotive vision systems

NXP demonstrates 'complete autonomous vehicle platform'

Programmable video bridge said to be first in ‘new product category’

Optical nanocavity boosts light absorption

Thin film semiconductors could be deposited on rolled up flexible surfaces