Engineering publications brought to you by Mark Allen

Interconnection

Mouser stocking Samtec’s COM-HPC interconnect solutions

ADI unveils new series of 10Gbps iCoupler digital isolators

Rambus to acquire PLDA and AnalogX

Small Cell Forum releases next generation 5G FAPI specifications

FTDI unveils single-channel interface ICs

Ranovus announces second-generation “co-packaged optics” chip

"Game changer" for optical telecom and data centre interconnect networks

CEA-Leti introduces plastic mmWave system

Third-generation 112G-LR SerDes IP

GUC announces GLink-3D Die-on-Die interface IP

STMicroelectronics looks to deliver protection for high-speed interfaces

Cadence unveils low-power IP for PCI Express 5.0 specification on TSMC N5 process