Engineering publications brought to you by Mark Allen

Research Design

Element Six and Orbray collaborate on diamond wafers

Novocomms secures £3.6m grant to develop 5G mmWave solution

Renesas and Indian ITH sign research and collaboration MoU

ASML and imec open joint HIgh NA EUV Lithography Lab

CGD signs agreement with ITRI to develop GaN-based power supplies

imec unveils die-to-wafer hybrid bonding with a Cu interconnect pad pitch of 2µm

Samsung/Arm collaboration drives software research in communication technologies

On-chip flow cytometer delivers scalable on-chip detection of human white blood cells

Imec’s NanoIC pilot line to receive investment of €2.5bn

Glasgow University wins grant for new semiconductor research facility

NEO Semiconductor reveals floating body cell mechanism for 3D X-DRAM

SiPearl chooses Italy to open its third international subsidiary