Engineering publications brought to you by Mark Allen

Electronics

Microchip’s RTG4 FPGAs achieve highest space qualification

eMemory and Siemens offer ‘groundbreaking’ SRAM repair toolset

CEA-Leti launches OpenTRNG project targeting industry and academic researchers

Samsung develops 24Gb GDDR7 DRAM for next-generation AI computing

High-temp FPC/FFC connector designed for automotive applications

Alif Semiconductor to support ExecuTorch framework on endpoint-AI applications

Micron launches ultra-fast clock driver DDR5 memory portfolio

Tria Technologies launches COM Express Type 6 Carrier Board

Outlook 2025: Embracing the chiplet journey

AC/DC flyback controllers improve power efficiency and reduce standby power consumption

Arm Total Design looks to bring AI CPU chiplet platform to market

Arteris NoC tiling innovation helps to accelerate designs for AI applications