Engineering publications brought to you by Mark Allen

Semiconductors

Tenstorrent and Imperas to provide Ascalon RISC-V Core model

Renesas RA8 series of MCUs based on Arm Cortex-M85 processor

Sofics releases its ESD technology on TSMC 3nm process

EnSilica to supply beamforming SatCom ICs to VITES for NGSO-constellations

XMOS and Symmetry announce distribution agreement

Cadence expands Tensilica IP portfolio with HiFi and vision DSPs

NXP expands automotive wireless connectivity portfolio with Wi-Fi 6E solution

Semidynamics launches first fully-coherent RISC-V Tensor unit

Micron Memory solution boosts XR experiences on Snapdragon XR2 Gen 2

Andes Technology unveils new RISC-V cores

Socionext developing SoCs for advanced ADAS and AD using 3nm automotive process

Qualinx’s Series A funding for GNSS IoT wireless technology hits $20mn