Engineering publications brought to you by Mark Allen

Embedded Systems

OKW’s Updated NET-BOX: Ideal For Wall-Mounted Embedded Electronic Systems

Tria introduces first HMM-RLP module featuring COM-HPC Mini form factor

Consolidating your options

Microchip’s SAMA7D65 MCUs provide advanced graphics and connectivity features

Tackling thermal hotspots

STM32C0 MCUs to ease entry into embedded development

Time for a change

ADLINK launches high-performance OSM-MTK510 module

TASKING acquires LDRA strengthening its range of software development tools

NXP set to acquire Edge AI pioneer Kinara in $300m deal

AI-Powered Engineering

SEGGER enhances SystemView with multicore support for advanced real-time analysis