Engineering publications brought to you by Mark Allen

Electronics

Winbond joins STMicroelectronics partner programme

Arm plans to make its own semiconductor - report

Esperanto Technologies running generative AI models on low-power RISC-V architecture

High-efficiency buck converters provide POL design versatility

eMemory's security-enhanced OTP qualifies on TSMC N5 process

StoreDot partners with Vines to accelerate XFC battery technology development

Trackwise awarded King’s Award for Enterprise for Innovation

Electrically conductive sealant offers high level EMI shielding

EdgeQ closes $75m Series-B investment

ST introduces automotive inertial module with certified ASIL B software library

Nexperia releases 650 V Silicon Carbide diodes targeting power conversion applications

Infineon’s LPDDR Flash Memory to enable next-generation automotive E/E architectures