Engineering publications brought to you by Mark Allen

Electronics

Efabless empowers commercial companies to design chips

Siemens introduces multiphysics cockpit for 3D IC design and verification

Two dual SAW Filters for use in multi-band communication systems

Movellus introduces Aeonic Power for On-Die voltage regulation

ASICs for additive manufacturing

Dracula Technologies announces production qualification of its Micropower OPV factory

Renesas’ R-Car Open Access platform to accelerate SDV development

TI and Delta Electronics announce advance electric vehicle onboard charging collaboration

QuickLogic joins Intel Foundry Accelerator IP

The 800V EV Transition: HIL Simulation's Critical Role

onsemi selects Czech Republic for SiC production for advanced power semiconductors

Smart Connectors and Smart Ecosystem