Engineering publications brought to you by Mark Allen

Research Design

Paving the way for standards to measure quantum computing performance

A 'Golden Age' of architecture

Scientists develop small, fast, and highly energy-efficient memory

Site for £65m National Manufacturing Institute Scotland identified

SET Introduces new automatic flip-chip bonder

Supermicro collaborates with Intel on large scale distributed training AI systems

Cree and STMicro extend SiC wafer supply agreement

Nordic Semiconductor reveals ‘world's first’ dual Arm Cortex-M33 processor wireless SoC

Outlook 2020 - Swapping Moore for Kurzweil in pursuit of accelerating returns

Cadence UltraLink D2D PHY IP targets AI and 5G

Outlook 2020 - New improvements in vehicle safety and comfort in view as RADAR sensors enable next generation ADAS

‘First’ AI processor that allows execution of multiple neural networks and entire workflows on single system