ASIC & SoC

Semiconductor industry to invest $400bn in 300mm Fab equipment

SIAE MICROELETTRONICA selects EnSilica to design ASICs for next-generation telecom equipment

Renesas develops power-efficient 4th-generation R-Car automotive SoCs

SiFive unveils XM Series to accelerate high performance AI workloads

Qorvo introduces next-generation Matter solution

TeraSignal introduces TSLink architecture

AlixLabs qualifies APS for use in 300mm designs

Faraday unveils platform for multi-source chiplet designs

Tenstorrent and Movellus to enable next-generation chiplet-based AI and HPC solutions

GlobalFoundries becomes Silicon Catalyst Partner

Advanced substrate market set for solid growth

Bluetooth 6.0 Channel Sounding supported by Nordic’s nRF54 Series SoCs