The platform has been developed to streamline the advanced packaging processes by integrating multiple vendors and multi-source chiplets and provides three core advanced packaging services - design, packaging, and production.
When it comes to chiplets, today’s advanced packaging capacity is increasingly limited, so this new platform looks to effectively coordinate the vertically disintegrated vendors of chiplet, HBM, interposer, and 2.5D/3D packaging and offer chiplets design, testing analysis, production planning, outsourcing procurement, inventory management, as well as 2.5D/3D advanced packaging services.
The platform provides a comprehensive one-stop solution with flexible services and business models tailored to the varied needs of clients and looks to ensures a consistent supply of critical components, including interposers and HBM, reflecting Faraday’s commitment to reliability, long-term supply, and business continuity.
In addition, Faraday is a leading designer of major chiplets, including I/O dies, SoC/Compute dies, and interposers. By partnering with UMC, Samsung, Intel, and other various OSAT providers, it can deliver advanced packaging solutions containing system-level design, power and signal integrity analysis, and thermal dissipation optimisation to support Intel’s EMIB, Samsung’s I-Cube, and 2.5D packaging in OSAT.
“Our new platform offers significant benefits to the industry,” said Flash Lin, COO of Faraday. “By leveraging our neutral position and delivering a comprehensive suite of services, we are well-positioned to drive innovation and improve project success in advanced packaging, ensuring superior results for our clients.”
