The commercial relationship, contracted to last ten years, will include the integration of SIAE MICROELETTRONICA design into custom-made ASICs.
This joint development will enable the Italian company to improve its portfolio using new technology and with new products that are in line with the targets of its IPCEI EMISPHERE program.
EnSilica has extensive expertise in developing high-performance radio frequency and complex digital systems and has developed reliable and robust supply chain management capabilities which were pivotal in securing the ASIC contract, according to the Italian company.
SIAE MICROELETTRONICA has developed a complete range of microwave and millimetre wave radio solutions and is working to improve the European value chain with in-house development of innovative modem chips and microwave components to enable the next generation of radio products for the mobile communications industry.
“We are delighted that SIAE MICROELETTRONICA selected our technical and commercial offering. As the demand for even higher data rates and the push for more power-efficient systems increases at pace, ASICs are becoming essential for the next generation of terrestrial and satellite telecommunications equipment” commented Paul Morris, VP RF and Communications Business Unit at EnSilica “And we look forward to working closely with their team to turn this project into a commercial success for both parties.”
“Our partnership is a strategic move that leverages EnSilica's expertise in ASIC design and SIAE's deep understanding of the microwave market,” explained Claudio Passera, SIAE MICROELETTRONICA Group R&D Director. “This unique combination positions us to develop innovative platforms and products that address the critical needs of emerging applications beyond 5G. By combining our strengths, we're gaining a significant competitive advantage and delivering customer-centric solutions that will solidify our leadership in the microwave radio and wireless network solutions space."
“This partnership between EnSilica and SIAE MICROELETTRONICA is the base of a successful project output, representing a very critical part of the overall IPCEI EMISPHERE project, which is a key element for SIAE MICROELETTRONICA’s plan for growth of technological solutions and expansion into new markets”, said Stefano Poli, SIAE MICROELETTRONICA Group Managing Director.
Ian Lankshear, Chief Executive Officer of EnSilica, added, “This significant contract marks the beginning of what we hope will be a long-term and mutually beneficial partnership with a key telecoms client. Our ability to both develop and deliver highly complex solutions continues to drive some of the world's leading equipment manufacturers to select EnSilica as the partner of choice.”
