Engineering publications brought to you by Mark Allen

CPUs

SkyWater Technology installs advanced 200 mm lithography

'Banking' electronic chips

Smart cockpit enables cost efficient infotainment solutions for smart mobility

Aitomatic announces SemiKong, an open-source LLM for the semiconductor industry

Samsung Electronics provides 2nm GAA process and 2.5D package to Preferred Networks

Microchip expands processing portfolio with multi-core 64-bit MCUs

Autotalks and Rolling Wireless accelerate 5G-V2X deployments

ESWIN Computing presents latest RISC-V Edge Computing SoC

Intel demonstrates first fully integrated optical I/O chiplet

Arduino shield simplifies use of fibre-optic datalink in MPU designs

SiFive presents 4th generation of Essential product line

CEA-Leti announces launch of FAMES Pilot Line