The return to growth is expected to see a 5.6% compound annual growth rate (CAGR) projected through to 2028, according to a new report compiled by SEMI, TECHCET and TechSearch International.
The report, Global Semiconductor Packaging Materials Outlook (GSPMO), highlights AI as an expected growth driver for advanced packaging applications, despite currently low unit volumes due to the newness of the market segment.
“After a challenging 2023, which saw a 15.5% decline in the semiconductor packaging materials market, our latest report forecasts a return to growth in 2024,” said Lita Shon-Roy, TECHCET President and CEO. “The global packaging materials market is expected to exceed $26 billion by 2025 and continue solid growth through 2028.”
“Substrates account for a large portion of the revenue for the packaging materials market, and within the category, FC-BGA substrates make up the majority of the revenue growth,” added Jan Vardaman, President of TechSearch International. “The CAGR for flip chip BGA/LGA revenue is expected to be 7.6% from 2023 to 2028.
“Other key growth areas include wafer-level packaging (WLP) dielectrics and flip chip underfill. The laminate substrates segment is expected to grow 7.3% annually in volume, while lead frames and bonding wire are also forecasted to recover, growing by 5.0% and 6.4%, respectively.”
