Engineering publications brought to you by Mark Allen

Electronics

Apple announces plans to hire UK AI staff

Exeger and Matrix Industries to develop low-power solutions for electronic devices

Automotive power-management ICs integrate CAN FD and LIN for simpler car-body controllers

Kneron raises $49m in additional funding

Pharrowtech and 8devices announce 60GHz wireless module collaboration

Swissbit launches Enterprise SSD N5200

Addressing UAV design complexity

Siemens and TSMC collaborate on optimising latest process technologies

DESIGN TIPS from ADI: Driving High Precision Analogue-to-Digital Converters

SiGe BiCMOS optical receiver achieves data rate of 200 Gbps

congatec launches SMARC 2.1 Computer-on-Modules

Winbond introduces CUBE architecture for Edge AI devices