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Industry Sectors

SK hynix begins volume production of 12-Layer HBM3E

TSMC and Samsung said to be considering building chip factories in UAE

MLCCs meet high-voltage demands of EV industry

SIAE MICROELETTRONICA selects EnSilica to design ASICs for next-generation telecom equipment

Quantum space sensor to fight climate change

DC EMC filter designed for high power EV charging applications

Broadcom delivers 200G/lane DSP for Gen AI infrastructure

Collaboration rolls out rail mmWave connectivity solution in the US

Mill-Max Expands Organic Fibre Plug® Receptacle Lineup

Samsung develops automotive SSD based on 8th-generation V-NAND

CEA-Leti paves way to piezoelectric converters without transformers

Toshiba introduces 32Gbps 2:1 multiplexer/1:2 demultiplexer switches