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Tensilica Xtensa processors address stringent automotive safety requirements

USB PD 3.1 high-voltage MCU with higher wattage support

Combinable M12 control cabinet feed-through connectors

Bipolar junction transistors in DPAK-package deliver high reliability for automotive and industrial applications

Voice-controlled multimodal AI solution

Mercury unveils processing module with integrated AI

First 176-Layer NAND mobile solution

Maxim Integrated teams up with Xailient to provide IoT face detection

First official Raspberry Pi recycling initiative

ON Semi extends XGS series with16 Mp sensor

MediaTek introduces the Kompanio 1300T platform

Blaize announces $71m Series D financing