Engineering publications brought to you by Mark Allen

Communications

Xscape Photonics raises $44 million in Series A funding

Google signs ‘world first’ deal to acquire nuclear power for AI datacentres

Infineon launches ultra-high current density power modules to support AI computing

5G in Space

Radisys joins 5G LEO satellite regenerative base station ecosystem partner program

UK project to secure quantum key distribution with OEM receiver modules

Serial consumers

SIAE MICROELETTRONICA selects EnSilica to design ASICs for next-generation telecom equipment

Broadcom delivers 200G/lane DSP for Gen AI infrastructure

Molex unveils versatile VaporConnect optical feedthrough modules

Ephos raises $8.5m and opens new facility for glass-based quantum photonic chips

Intel and AWS look to expand strategic collaboration