Engineering publications brought to you by Mark Allen

Policy & Business

EMC legislation continues to evolve

Computex Taipei 2011

Directives and standards needed when designing for medical applications

Fault tolerant designs allow defective chips to be used instead of scrapped

Chipmakers move to 3d to create successor to multichip module

Government calls for future R&D funding to focus on new technologies

IEEE launches new Ethernet bandwidth group, looks beyond 100Gbit

Repeaters triple reach of PCI Express Gen-3 Standard

Designing for extreme temperatures

AMD to support USB 3.0

R&D competitions launched to accelerate UK innovation

Remote Sensing Workshop - Meeting Industry Needs with NERC Expertise