Engineering publications brought to you by Mark Allen

New Electronics

Wafer level packaging costs reduced by up to 30% with new approach

Programmable buck converter reduces footprint

Programmable clock generators offer 'best in class' jitter performance

'Intelligent' power modules from ON Semiconductor

Emerging format offers shock and vibration resistance to COM users

Murata claims first for surface mount ultrasonic sensor

MEMS microphones push performance levels in consumer products

The latest trends in test and measurement

Samsung begins mass production of 20nm DRAM

ARM's v8-R architecture to enable new types of MCU?

Multilayer OPV cell achieves record efficiency

Thermal camouflage could have application in heat management of electronics components