Engineering publications brought to you by Mark Allen

News

RF & Microwave

Filtronic automates wedge bonding for complex wire components

Manufacturing

Microchip to invest $880m to expand SiC and Si capacity

Space

EnSilica to develop satellite communications chip for terminals

Electronics

Winbond joins UCIe Consortium to support chiplet interface standardisation

5G

Arctic Semiconductor ships IceWings, its first 5G RF chipset

Automotive

ServCity consortium brings autonomous mobility a step closer to deployment in UK’s cities

Memory

The Six Semiconductor announces tape-out of two 7nm test chips

EDA & Design Software

Tachyum validates Prodigy Universal Processor with Kubernetes

Sensors

Oculi forms strategic partnership with GlobalFoundries

EDA & Design Software

Cadence delivers 13 new VIP solutions

Electronics

Texas Instruments selects Utah for its next 300mm wafer fab

Sensors

Murata unveils highly accurate soil monitoring system