Engineering publications brought to you by Mark Allen

News

£53 million digital technology funding boost for UK manufacturers

Memory

Nexperia looks to enable large logic functions in small form factor systems

Embedded Systems

ST manufactures first 200mm silicon carbide wafers

Embedded & Programmable

GOWIN Semiconductor announces ISP IP core and solution

Board Level Design

Bulgin launches connector/cabling configuration tool

Communications Hardware

Easier user interface design of IoT applications

Memory

CrossBar announces ReRAM Based PUF Keys

Research Design

Funding for next generation diamond-enabled technologies

CPUs

ST extends support for ML in STM32Cube.AI ecosystem

Wireless Technology

CEVA announces launch of RivieraWaves Bluetooth 5.3 IP

Embedded Systems

Winbond's OctalNAND Flash interoperates with Synopsys DesignWare AMBA IP

Internet of Things

B-Secur collaborates with TI to deliver ECG/EKG monitoring for wearable devices