Engineering publications brought to you by Mark Allen

News

Memory

Samsung completes validation of industry’s fastest LPDDR5X

Power

TI unveils magnetic packaging technology for power modules

Automotive

Smart cockpit enables cost efficient infotainment solutions for smart mobility

Test & Measurement

Telonic adds Siglent’s latest 12-bit oscilloscopes to its portfolio

EDA & Design Software

ESD revenues jump to $4.5bn in Q1 2024

Distribution

TTI Europe signs distribution agreement with Chemi-Con

Space

Ramon.Space launches new UK subsidiary

Artificial Intelligence

Renesas introduces the Reality AI Explorer Tier

Memory

Teledyne e2v 8 GB DDR4 memory chip targets high reliability space applications

Wireless Technology

Atmosic powers new Bluetooth beacon from blukii

Memory

OPENEDGES validates its 7nm HBM3 testchip

Sensors

ST unveils single-zone direct-ToF sensor