These power modules look to leverage TI’s proprietary MagPack integrated magnetic packaging technology, shrinking their size by up to 23% compared to many existing modules on the market. In fact, three of the six new devices, the TPSM82866A, TPSM82866C and TPSM82816, are the industry’s smallest 6A power modules, supplying a power density of nearly 1A per 1mm2 of area.
“Designers turn to power modules to save on time, complexity, size and component count, but these benefits have usually required a compromise on performance,” said Jeff Morroni, director of power management research and development at TI’s Kilby Labs. “After nearly a decade in the making, TI’s integrated magnetic packaging technology enables power designers to meet the defining power trend that has shaped our industry – pushing more power in smaller spaces efficiently and cost-effectively.”
When it comes to designing for power, size really does matter. Power modules simplify power designs and save valuable board space by combining a power chip with a transformer or inductor in one package. By leveraging TI’s 3D package moulding process, MagPack packaging technology maximises the height, width and depth of the power modules to push more power in a smaller space.
The magnetic packaging technology includes an integrated power inductor with proprietary, newly engineered material. As a result, engineers can now achieve improved power density and reduce temperature and radiated emissions while minimising both board space and system power losses.
These benefits are especially important in applications such as data centres, where electricity is the biggest cost factor, with some analysts predicting a 100% increase in demand for power by the end of the decade.
