Engineering publications brought to you by Mark Allen

News

Robotics Innovation Hub Introduced to Engineering Design Show 2019

Distribution

Anglia PR named UK and Ireland distributor for IXYS

Consumer

Japan to tighten curbs on tech material exports to South Korea

ASIC & SoC

Cadence unveils first-to-market DisplayPort 2.0 verification IP

Communications Hardware

CEA-Leti & Radiall to design innovative RF and photonics components

CPUs

Chirp now supporting Arm Cortex architectures

Interconnection

Analog Devices and First Sensor developing LIDAR

Internet of Things

SMLL announces London test routes for self-driving cars

Research Design

NeuroBlade raise fund to suppory new AI chip development

Consumer

MagnaChip looks to enhance 5G/LTE smartphone battery life and protection

Automotive

CEA’s precise localisation technology boosts quality control and efficiency

Memory

Winbond supports accelerated roll-out of 5G CPE modems