Engineering publications brought to you by Mark Allen

News

Consumer

MediaTek’s Dimensity 7300 chips target high-tech smartphones and foldables

Electronics

Arm unveils CSS for Client initiative

ASIC & SoC

World’s first highly integrated multi-mode LTE chipset supporting 450 MHz spectrum

Electronics

CGD signs agreement with ITRI to develop GaN-based power supplies

Electronics

imec unveils die-to-wafer hybrid bonding with a Cu interconnect pad pitch of 2µm

Electronics

Malaysia looks for over $100bn in semiconductor industry investment

Artificial Intelligence

Epic Venture Partners invests $8.1m in Rain AI

Electronics

Dolphin Design and Raspberry Pi offer advanced chip power management

Artificial Intelligence

HCLTech and Arm collaborate on custom silicon chips for AI workloads

Electronics

Infineon looks to redefine power density and efficiency in AI server power supplies

ASIC & SoC

Weebit Nano and Efabless collaborate to enable prototyping of SoC designs

Artificial Intelligence

Agnostiq announces major update to the Covalent Platform