Engineering publications brought to you by Mark Allen

News

Research Design

Chip bends light to project images

Research Design

2D material holds promise for next gen optoelectronics

ASIC & SoC

Cadence, GloFo tape out Cortex-A12 test chip

Manufacturing

Wafer level packaging costs reduced by up to 30% with new approach

Semiconductor equipment sales down 14%

Cut tuition fees for STEM subjects, urges CBI

Test & Measurement

Murata claims first for surface mount ultrasonic sensor

Consumer

MEMS microphones push performance levels in consumer products

Memory

Samsung begins mass production of 20nm DRAM

Automotive

ARM's v8-R architecture to enable new types of MCU?

Research Design

Multilayer OPV cell achieves record efficiency

Defence & Security

Thermal camouflage could have application in heat management of electronics components