Engineering publications brought to you by Mark Allen

News

Memory

Next gen HMC spec launched

CPUs

Embedded World 2014: NXP looks to streamline motor control

IR opens ultra thin wafer processing facility in Singapore

System Design

Embedded World 2014: MCXO delivers ±50ppb stability from tiny package

Power

Vicor extends design service to EU market

ASIC & SoC

Multi-user approach claimed to solve growing verification challenge

Test & Measurement

Embedded World 2014: Tektronix launches six-in-one scope

EU semi sales 'back on track'

RF & Microwave

Embedded World 2014: CSR has Bluetooth Smart solution for the connected home

TSB chief to lead Knowledge Transfer Network

RF & Microwave

IoT demand spurs Digi-Key expansion

Aerospace

Antenna offers enhanced positioning for GNSS devices