IR opens ultra thin wafer processing facility in Singapore

Dubbed IRSG, the 60,000sq ft manufacturing site will be used to process a number of products, including the company's latest generation power MOSFETs and IGBTs. Wafer thinning, metallisation, testing and additional proprietary wafer level processing will also be carried out. Oleg Khaykin, IR's president and ceo, said: "IRSG will help improve IR's flexibility and production cycle time by providing advanced wafer processing for wafers manufactured internally or at our foundry partners. "Furthermore, it will allow IR to consolidate final wafer processing in close proximity to our major assembly locations."