The UltraLink D2D PHY IP is an enabling technology for chiplet and system-in-package (SiP) applications, and looks to enable system-on-chip (SoC) providers to deliver more customised solutions that offer higher performance and yields while also shortening development cycles and reducing costs through greater IP reuse.
The UltraLink D2D PHY IP looks to deliver up to 40Gbps wire speed in an NRZ serial interface, providing up to 1Tbps/mm unidirectional bandwidth. The IP includes built-in de-skew and scrambling/de-scrambling logic to enable easy system integration. Its low wire count of 28 data wires for 1Tbps bandwidth enables easier routing and potentially reduces package cost, whereas alternative solutions can require 30% or more wires.
While some existing lower speed die-to-die solutions require a silicon interposer to achieve the same bandwidth, the UltraLink D2D PHY IP offers cost advantages by supporting multi-chip modules on organic substrates. This IP features latency as low as 5ns round trip from receiver to transmitter, utilises standard non-return-to zero (NRZ) coding and achieves better than 10-15 bit error rate (BER) without requiring forward error correction (FEC). The UltraLink D2D PHY IP is silicon proven in an advanced 7nm FinFET process.
“As AI and ML in the cloud pose more aggressive computing demands, Cadence continues to invest in design and interface IP that addresses our customers’ rapidly evolving requirements,” said Rishi Chugh, vice president of product marketing, IP Group at Cadence. “Maximising data transfer with minimal area and power consumption is paramount. The UltraLink D2D PHY IP is the latest addition to our HPC IP portfolio and a critical new technology delivering high bandwidth, low power and latency while extending Cadence’s ongoing investment to support heterogeneous integrated packaging solutions and designs."
