Celsius Studio has been developed to address thermal analysis and thermal stress for 2.5D and 3D-ICs and IC packaging, in addition to electronics cooling for PCBs and complete electronic assemblies.
According to Cadence, while current product offerings consist mostly of disparate point tools, Celsius Studio introduces an entirely new approach with a unified platform that lets electrical and mechanical/thermal engineers concurrently design, analyse and optimise product performance without the need for geometry simplification, manipulation and/or translation.
Celsius Studio drives convergence between electro-thermal co-simulation, electronics cooling and thermal stress to provide one cohesive offering.
This has been made possible by Cadence’s acquisition of Future Facilities in 2022, with electronics cooling technology now accessible to electrical and mechanical engineers. Additionally, the ability to employ Celsius Studio seamlessly for in-design multiphysics analysis will empower designers to identify thermal integrity issues early in the design process and efficiently leverage generative AI optimisation and novel modelling algorithms to determine ideal thermal designs.
The result is a streamlined workflow that improves collaboration, reduces design iterations and allows predictable design schedules, which in turn reduces turnaround times and accelerates time to market.
Celsius Studio delivers a number of benefits including:
- ECAD/MCAD Unification – Provides seamless integration of design files with no simplification as well as streamlined workflows for fast and efficient in-design analysis
- AI Design Optimisation – Cadence Optimality Intelligent System Explorer’s AI technology within Celsius Studio enables fast and efficient exploration of the full design space to converge on the optimal design
- In-Design Analysis of 2.5D and 3D-IC Packages – Delivers the capacity to analyse any 2.5D and 3D-IC packages without any simplification or accuracy loss
- Micro-to-Macro Modelling – The first solution can model structures as small as the IC and its power distribution and as large as the chassis where the PCB(s) are placed
- Large-Scale Simulation – Accurately simulates large systems with detailed granularity for any object of interest including, chip, package, PCB, fan or enclosure
- Multi-Stage Analyses – Enables designers to perform multistage analyses for the design assembly process and addresses 3D-IC warpage issues for multi-die stacks on a single package
- True System-Level Thermal Analyses – Combines finite element method (FEM) with computational fluid dynamics (CFD) for full-system thermal analysis from chip to package to board and end-system
- Seamless Integration – Integrated with Cadence’s implementation platforms, including Virtuoso Layout Suite, Allegro X Design Platform, Innovus Implementation System, Optimality Intelligent System Explorer and AWR Design Environment.
“Celsius Studio marks a milestone in Cadence’s expanding presence in the system analysis market by offering the first AI platform for not only chip, package and PCB thermal analysis, but also electronics cooling and thermal stress that are critical for today’s advanced packaging designs, inclusive of chiplets and 3D-ICs,” said Ben Gu, corporate vice president of R&D for multiphysics system analysis at Cadence. “Seamless integration with Cadence’s powerful implementation platforms empowers our customers to perform multiphysics in-design analysis for chips, packages and boards all the way through to complete systems.”
