Collaboration means greater functionality for mobile devices

This, says Qualcomm will result in a high level of cost efficiency and the expansion of wireless into new market segments. Qualcomm and Taiwan Semiconductor Manufacturing Co are working closely on migrating directly from the 45nm to the 28nm and Jim Clifford, senior vice president and general manager of Qualcomm CDMA Technologies, explained that small form factor and low power consumption are important features of Qualcomm's next generation of SoC solutions. Clifford said: "Qualcomm's close collaboration with TSMC has always been a key part of our ability to deliver significant advantages to our customers through the industry leading integration, power efficiency and cost efficiency of our products – enabling them to do more with less. Qualcomm's integrated fabless manufacturing model and migration to smaller geometries will allow us to continue enabling the best mobile user experience possible." The two companies plan to continue their relationship into low power, low leakage 28nm designs for high volume manufacturing. They claim that these designs will deliver up to twice the density of previous manufacturing nodes and are working on both high-k metal gate 28hp and silicon oxynitride 28lp technologies. Qualcomm expects to push out its first commercial 28nm products in mid 2010.