The appointment forms part of a long-term growth strategy, with additional regional sales partners to be announced in the coming months.
Founded in 2011, QLS has developed ASIC design-in experience across consumer, industrial, healthcare, broadband wireless and satellite communications sectors. Over the past 11 years, it has successfully grown both SIP (Semiconductor Intellectual Property) and ASIC revenues in North America for its partners. In addition to the Bay Area QLS has sales offices in Los Angeles, Austin, Texas and Boston, Massachusetts to support its customers across North America.
Commenting Peter Jeutter, EnSilica’ s Germany-based VP of sales said, “The ASIC design market is traditionally used by two very different types of organisation: the very established players, such as large industrial and automotive Tier 1s; and start-ups and very niche companies looking to put their ideas into silicon and have real market differentiation.
“We are experienced in working with both types of business. This move helps us to also reach the potential market that lies between these two disparate groups. QLS has a fantastic track record in achieving this - for example with Dialog Semiconductor, before its recent acquisition by Renesas, where it enabled Dialog to forge even more high value partnerships with customers.”
Mike Ingster, Founder and President of QLS added, “EnSilica’s deep knowledge of DSP for beamforming and radar along with their mixed signal RF & mmWave and automotive expertise makes them unique and ideal partners for companies wishing to develop complex products such as radar, lidar and satellite user terminals. We believe we will have great interest from our customer base and we are really looking to work with EnSilica.”
EnSilica’ s mixed signal ASICs are focused and sensing and control applications including automotive, industrial and healthcare as well as RF and communications specifically in the satellite communications sector.
In 2022 it announced partnerships and projects that include taking an ASIC to production for a high-end carmaker, the development of a satellite-to-mobile communication chip and the launch of its own healthcare sensor-interface IC.
