Under this agreement, the companies will work together to leverage Omni Design’s advanced data converter solutions together with EnSilica’s turnkey ASIC solutions, to service the needs of customers developing next generation products.
Integrating high-performance analogue IP cores into increasingly complex SoCs is now seen as essential for applications such as 5G, communication systems, LiDAR and radar especially in advanced process nodes.
However, it requires seamless collaboration between the ASIC supplier and the IP provider to deliver the functionality and cutting-edge performance required in the SoC. To date, engineers from Omni Design and EnSilica have been working closely together on multiple customer projects to develop complex SoCs that are going to be deployed in production systems.
"Omni Design is delivering high-performance data converters in advanced process nodes to enable the next generation of products in automotive, 5G, and AI markets,” said Dr. Kush Gulati, president and CEO of Omni Design Technologies. “EnSilica has a very experienced team with proven ability to integrate mixed-signal IP into complex SoCs. We look forward to working with them in this partnership in support of our customers.”
“EnSilica has deep expertise in custom RF front-ends and mixed-signal design as well as the production of SoCs for automotive and advanced communication systems,” explained Ian Lankshear, CEO of EnSilica. “The high-speed data converter IP from Omni Design is amongst the most advanced in the semiconductor industry and we see many opportunities to work together to service our customers who are developing cutting-edge products.”
