IBM takes SoI into the asic world
IBM has unveiled semiconductor devices which take advantage of its latest technology breakthroughs. Amongst the, IBM’s Cu-45 asic is said to be the first commercial use of silicon on insulator (SOI) technology in the communications and consumer segments. In addition, the Cu-45HP asic features embedded dram implemented in SOI technology.
IBM’s embedded dram technology on SOI is said to improve on processor memory performance, but to use about one third the space and one fifth of the standby power of conventional sram.
Also announced was the SiGe BiCMOS 5PAe – the first IBM product to use its through silicon via technology.
“The market can now take advantage of chip products that harness IBM’s leadership in research and innovation,” said Tom Reeves, vice president, IBM GES Semiconductors and Services. “From the first ASIC SOI chip at 45nm to the use of the new embedded dram and chip integration technologies, the advances that are part of these new semiconductor offerings enable flexible, cost effective products that enhance the value of customised IBM semiconductor solutions.”
