Both companies are developing a solution that embeds Infineon’s 1200 V CoolSiC chips directly onto printed circuit boards (PCB) – a move that could help to increase the range of electric vehicles and reduce the total system’s cost.
The companies have already demonstrated the potential of this new approach and were able to embed a 48 V MOSFET in a PCB. This resulted in a 35 percent increase in performance.
Schweizer is contributing its innovative p²Pack solution to the project, which enables power semiconductors to be embedded in PCBs.
“Our joint goal is to take automotive power electronics to the next level,” said Robert Hermann, Product Line Head Automotive High-Voltage Discretes and Chips, of Infineon. “The low-inductive environment of a PCB allows clean and fast switching. Combined with the performance of 1200 V CoolSiC devices, chip embedding enables highly integrated and efficient inverters that reduce overall system costs.”
“With Infineon’s 100 percent electrically tested standard cells (S-Cell), we can achieve high overall yields in the p² Pack manufacturing process,” said Thomas Gottwald, Vice President Technology at Schweizer Electronic. “The fast-switching characteristics of the CoolSiC chips are optimally supported by the low-inductance interconnection that can be achieved with the p² Pack. This leads to increased efficiency and improved reliability of power conversion units such as traction inverters, DC-DC converters, or on-board chargers.”
