Infineon completes €35m miniature SiP project

The ESiP (Efficient Silicon Multi-Chip System-in-Package Integration) project partners have reportedly worked out future SIP solutions that are more compact and reliable. They have also developed methods for simplifying analyses and tests. "With the EsiP findings we will be able to further miniaturise and improve microelectronic systems," commented Project leader Dr Klaus Pressel. "We have developed new manufacturing processes and materials for SiP solutions along with methods for testing them, running a failure analysis on them and evaluating their reliability." The research partners hope to use the miniaturised SiPs for applications such as electric vehicles, industrial, medical equipment and communications technology. The group claims to have developed basic technologies that enable the integration of various types of chips in the smallest volume SiP packages - for example, customer specific processors with the latest cmos technologies, leds and dc/dc converters, MEMS and sensor components and passive components such as miniaturised capacitors and inductors. The team also investigated new materials for building SiPs. According to Infineon, their efforts led to a number of innovations ranging from the development of materials to manufacturing process and testing methodologies.