Engineering publications brought to you by Mark Allen

System in package

Skyworks and Sequans unveil LTE-M/NB-IoT System-in-Package solution

New secure IoT beacon

Why is system-in-package (SIP) becoming a more viable option for system design engineers?

World’s smallest Bluetooth low energy module

Industry’s first heterogeneous SiP devices integrates HBM2 DRAM with FPGAs

Infineon completes €35m miniature SiP project

SMEs to benefit from €4.9million SiP European project

Collaboration leads to first Wi-Fi system in package development system

NXP targets industrial communications with mcu, CAN system in package