Infineon, Fairchild expand power mosfet compatibility partnership

The leadless SMD package integrates the low side and high side mosfet of a synchronous dc/dc converter into a 5x6mm² package outline, enabling a reduction of design area by up to 85%. The package is also designed to minimise loop inductance and achieve a peak efficiency of 93.5%. The collaboration began in 2010 and was designed to combine both companies' experience in asymmetric dual mosfets that can handle more than 30A and increase power density. "Fairchild and Infineon have standardised the pin out, providing customers a secure supply chain for their high efficiency design needs in the computing, telecom and server markets," said Richard Kuncic, senior director, Low Voltage Power Conversion at Infineon Technologies. "This package alignment is staged to deliver performance leading products in a multisource, industry standard package." Joe Montalbo, Fairchild's vice president and general manager, Consumer, Communications and Industrial, Low Voltage, added: "We are pleased to have added these enhancements to our PowerTrench technology", said. "This partnership with Infineon, along with the standardised pin outs, helps to improve the value proposition of this product line and makes it more compelling to our customers."