Pin out standardisation for 3x3mm mosfets

The agreement is said to have been made in response to the need for supply security, while balancing the drive towards best-in-class efficiency and thermal performance in dc/dc conversion. It takes advantage of both companies expertise in asymmetric, dual and single mosfets for dc/dc applications from 3A to 20A. "Standardising power packages benefits our customers as we minimise the amount of 'unique' packages available in the market, while offering solutions that enhance performance levels in smaller form factors than the previous generations," said Richard Kuncic, low voltage mosfet product line manager for Infineon. John Bendel, Fairchild's senior vice president of low voltage products, added: "Fairchild and Infineon have standardised the pin out and have complementing performance levels, offering customers two sources for their high efficiency design needs in the computing, telecom and server markets. This package alignment is staged to deliver performance leading products in a multisource, industry standard package."