Infineon and Fairchild enter into compatibility agreement for mosfets
Infineon Technologies and Fairchild Semiconductor have announced they are to standardise power packages, with a view to minimising the number of incompatible packages in the market.
The partnership has been agreed for power mosfets in the Infineon PowerStage 3x3 or Fairchild MLP 3x3 (Power33) packages.
According to John Bendel, Fairchild's senior vice president of Low Voltage Products, the compatibility agreement is said to be a response to the need for supply security while balancing the drive towards efficiency and thermal performance in DC-DC conversion.
Bendel said: "Fairchild and Infineon have standardised the pin-out and have complementing performance levels, offering customers two sources for their high efficiency design needs in the computing, telecom and server markets. This package alignment is staged to deliver performance leading products in a multi-source, industry standard package."
