Intel to invest $4.1bn in ASML to accelerate 450mm wafer and EUV developments

The company says the objective is to shorten the schedule for deploying the lithography equipment supporting these technologies by as much as two years, resulting in significant cost savings and other productivity improvements for semiconductor manufacturers. "The transition from one wafer size to the next has historically delivered a 30 to 40% reduction in die cost and we expect the shift from today's standard 300mm wafers to larger 450mm wafers to offer similar benefits," commented Brian Krzanich, Intel senior vp and coo. "The faster we do this, the sooner we can gain the benefit of productivity improvements, which creates tremendous value for customers and shareholders." Intel says it will participate in a multi party development programme which includes funding ASML's R&D efforts as well as equity investments in the company. ASML will sell up to a 25% aggregate stake to Intel and other semiconductor manufacturers in the programme, but Intel's ownership stake will not exceed 15%. "We are extremely encouraged that Intel has made these investments, which will benefit every semiconductor manufacturer in the industry," said Eric Meurice, ASML president and ceo. "We hope to be able to announce additional investments by our other customers in the coming weeks."