The agreement is with Azoteq, a developer of high volume sensor fusion ICs used in industrial and consumer applications.
Nanusens technology enables its MEMS (Micro Electro Mechanical Systems) IP sensor structures to be made at the same time within a chip as other IP on the ASIC using standard CMOS processes, resulting in ASICs with embedded MEMS sensors.
Described as a breakthrough in the integration of sensor solutions as IP blocks, this technology offers dramatic reductions in costs and size as it completely replaces the current solution of discrete sensor packages.
Commenting Dr Josep Montanyà, CEO of Nanusens, said, “Azoteq is one of a number of companies that recently received samples of our 3D accelerometer that were created using an IP block within an ASIC. Azoteq is the first to sign an IP license and we plan to announce several more license deals soon.”
Dr Dieter Mellet, Azoteq’s CTO, commented, “Our business is based on creating multi-sensor solutions for customers who often need to include many sensors into space-constrained applications. Nanusens technology enables monolithic integration of MEMS within an IC and is perfect for us as we can now embed an array of 3D accelerometers into an existing IC, providing cost, power and space saving to our customers over current solutions available today further expanding our ProxFusion offering.”
Nanusens is finalising a successful Crowdcube fundraise on the 16 of June 2023 to provide the funds to port this technology to a range of smaller process nodes to meet customer requirements.
