NetLogic announces its first silicon tape out in TSMC's advanced 28nm process
1 min read
NetLogic Microsystems has developed and taped out its next generation silicon in the advanced 28nm process at Taiwan Semiconductor Manufacturing Company (TSMC).
According to the intelligent semiconductor solutions specialist, the process offers up to 50% higher speed, 40% lower power and 100% higher gate density compared to the 40nm node. Compared to the 65nm node, NetLogic says it offers up to 120% higher speed, 60% lower power and over 300% higher gate density.
As an early access/development partner for TSMC's 28nm process, NetLogic is migrating its next generation multicore processing, knowledge based processing and 10/40/100 Gigabit PHY product lines to the advanced process node. The 28nm products are targeted at next generation long term evolution (lte), IPv6, data centre and security markets.
"I congratulate our team on this major milestone and for continuing to outperform the industry on engineering execution excellence by having taped out a very complex silicon for next generation network infrastructure applications," said Ron Jankov, president and ceo at NetLogic Microsystems. "Our strategy to be on the forefront of manufacturing technologies and be one or two nodes ahead of our competition has helped us grow market share in knowledge based processors, 10/40/100GE PHY and now multicore processors."
NetLogic says it will introduce multiple new products in 28nm throughout 2011.
