NXP unveils MC33777 battery pack monitoring technology for EVs

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NXP Semiconductors has unveiled the MC33777, said to be the world’s first battery junction box IC that integrates critical pack-level functions into a single device.

Credit: NXP Semiconductors

Unlike conventional pack-level monitoring solutions that require multiple discrete components, external actuators and processing support, the MC33777 has consolidated essential BMS functions and significantly reduces design complexity, qualification and the software development effort.  Consequently, the cost to OEMs has been reduced while the overall performance of the system has been improved.

This IC can help protect high-voltage batteries from overcurrent by constantly monitoring the battery current and slope every eight microseconds. It has been designed to detect and react to a wide matrix of configurable events up to 10 times faster than conventional ICs, for example, without waiting for specific current thresholds to be exceeded.

The MC33777‘s fuse-emulation technology also enables the removal of expensive and low-reliability melting fuses from the system, yielding significant cost savings for OEMs and Tier 1s, increasing reliability and enhancing safety for the vehicle occupants.

Electric vehicles traditionally deploy melting fuses to disconnect power to the vehicle in the event of an overload, with reliability as a critical safety factor.

Commenting Jesus Ruiz Sevillano, Director of Product Marketing BMS at NXP said, “Integrating everything that’s required to monitor a battery pack and react quickly to safety-critical events into a single device delivers significant benefits for both OEMs and the end consumer. NXP’s MC33777 marks a new generation of battery junction box ICs for electric vehicles, delivering faster, safer and more affordable management solutions for high-voltage battery packs.”

The simplification of the IC is one of the biggest advantages. The MC33777 reduces the component count by up to 80%, limiting required printed circuit board (PCB) space and reducing software development effort due to hardware implementations. As a result, the integration of NXP’s latest battery junction box IC helps accelerate design cycles and shortens the time-to-market for next-generation EVs.

For the consumer, the MC33777’s faster reaction times help to provide additional safety such as the reduction of the risk of electric shocks to passengers in case of a crash. More accurate measurements also result in extended range, meaning drivers can enjoy greater distances between charges.

The MC337The77 battery junction box IC is the latest addition to NXP’s Electrification system solution portfolio which includes battery cell controllers, battery gateway ICs, and production-grade software and safety documentation.