RF silicon on insulator (SOI) pioneer Peregrine Semiconductor has announced UltraCMOS 11, said to be the industry's first RF SOI technology. By moving to 300mm wafers, the company says it is opening the door to new enhancements and advanced features in future generations of the UltraCMOS technology platform.
"For more than 25 years, Peregrine has been at the forefront of advancing RF SOI technology," said Jim Cable, the company's CEO. "That legacy continues with today's introduction of the UltraCMOS 11 platform, the first RF SOI 300mm technology platform. By using 300mm wafers, Peregrine ensures our technology roadmap will continue to be on the leading edge of RF SOI."
Peregrine developed UltraCMOS 11 in association with Globalfoundries, using a custom fabrication flow at Fab 7 in Singapore.
Brian Harrison, senior vice president of integration and factory management at Globalfoundries, said: "We are pleased to see the tremendous efforts resulted in this achievement, and we will continue to leverage our RF process development expertise and manufacturing scale to maximise the technology's capabilities and drive differentiation with our customers."
UltraCMOS 11 platform will be the foundation for Peregrine's high volume mobile products and SOI products for other applications.
