Based in North Wales, RAM delivers an array of specialist services. These are mainly in relation to semiconductor packaging development and manufacture.
It has a comprehensively equipped facility with die placement/bonding, laser direct imaging, lamination, CNC machining and surface-mount technology (SMT) processing machinery, plus a wet chemistry development area that houses metallisation and chemical milling operations.
RAM carries out various embedded die packaging (EDP) activities including advanced sequential build-up processing techniques, that incorporate wide bandgap technologies like Silicon Carbide (SiC) and Gallium Nitride (GaN) helping customers to access the significant benefits that EDP offers - including reduced footprint, better electromagnetic interference management, superior electrical connectivity for elevated switching speeds, as well as improved thermal conductivity.
RAM is able to support customers’ product development projects - covering proof of concept, 3D modelling evaluation and thermal analysis, through to prototyping builds, product testing, micro-sectioning analysis and low-volume EDP manufacturing.
Now, with the support of Russel Industries, RAM will be able to take these projects all the way to high-volume production.
“We have been really impressed with the capabilities that the RAM team possess, and recognise that there is a huge opportunity to bring their embedded die packaging expertise to a wider audience,” said Nick Russel, CEO of Russel Industries. “By benefitting from the manufacturing strength that we have within the group, RAM will be better able to serve the needs of the wide bandgap community.”
“Though only a small operation, RAM has built up a strong reputation for providing superior semiconductor engineering,” added Geoff Haynes, Product Development Manager at RAM. “Now, by joining forces with Russel Industries, we will be able to scale up the production aspect of our business. This is certain unlock the full potential of our embedded die packaging technology in relation to next generation power module development within the electric vehicle and renewable energy sectors.”
