Samsung Electronics joins ASML’s euv development push
Samsung Electronics – the last of the three leading semiconductor manufacturers – has joined ASML's Customer Co-Investment Program for Innovation. Under the terms of the agreement, Samsung will contribute €276million to ASML's research and development of next generation lithography technologies over the next five years.
Contributions from Apple, TSMC and now Samsung take the amount raised to €1.38 billion. Samsung has also committed to invest €503m in a 3% equity stake in ASML under the same general terms as Apple and TSMC. Between them, the three companies have bought a 23% stake in ASML for €3.85bn, although the shares will be non voting, except under 'exceptional conditions'. No further participation will be sought, says the company.
The Co-Investment Program has been designed to accelerate the development of key technologies needed to extend Moore's Law, including extreme ultraviolet lithography. While ASML was targeting the end of the decade to introduce these technologies, semiconductor manufacturers have been pushing for more rapid progress.